5600 Thin Film Deposition System
- Low cost, computer controlled deposition system
- Quartz crystal sensor and substrates rotate on the same spherical radius for accurate thickness deposition control
- Pneumatic actuated source shutter for precise deposition termination
- Each substrate holder can be plated to a different thickness in the same deposition cycle
- Mechanical assemblies shielded from deposition material are easily removed for cleaning
- Two spring mounted filament holders for extended filament life
- Low profile bell jar assembly for easy operator access
- Substrate heater
- Surface preparation by RF plasma bombardment to promote adhesion to the substrate
- Fast pump down time for high system throughput
SPECIFICATIONS
| Thickness Uniformity: | 2% of total deposition, typical |
MAIN SCREEN DISPLAY
Showing each mask status and deposition target.
SYSTEM CONFIGURATION
- Computer
- Direct Drive Roughing Pump
- Cryo or Diffusion Pump
- Light Pole
- System Software
- Automatic Mask Flipping Mechanism
- Printer (optional)
- Substrate Heater
- Plasma Cleaning (optional)
- Two Metal, Multilayer Capability
FACILITY REQUIREMENTS
| Power: | 380 or 208V 3-PHASE, 7 KVA, 50/60 Hz |
| Inlet Pressures: Air: Nitrogen: |
90 -; 100 PSIG 70 -; 100 PSIG |
| Argon (plasma cleaning): | 10 - PSIG |
| Cryo Pump Water Cooling: | 0.5 GPM @ 60°-80° F |
| Diffusion Pump Water Cooling: | 0.25 GPM @ 60°-80° F |
| Dimensions: | W 53 x D 34 x H 67.5 Inches (excluding- Cryo Compressor) |