W-5600 Base Plating System
- Fully automated, computer controlled Base Plating System
- S&A 250B Network Analyzer Monitor Crystal Measurement System
- Quartz monitor crystal rotates on the same spherical radius as devices being plated for accurate plating control (Patent No. 6,090,444)
- Each mask can be plated to a different thickness in the same deposition cycle
- Mechanical assemblies shielded from plating material and easily removed for cleaning
- Two spring mounted filament sources for extended filament life
- Low profile bell jar assembly for easy operator access
- Supports various mask systems
- Substrate heater
- RF plasma bombard
- Plating units: Å, Hz, F², Å of Si 02
- Fast pump down time for high system throughput
SPECIFICATIONS
| Plating Uniformity: | 2% of plateback typical * |
| * Performance based on mask dimensions of not greater than 3 x 4.2 inches. | |
SYSTEM CONFIGURATION
- Direct Drive Roughing Pump
- Cryo or Diffusion Pump
- Automatic Mask Flipping Mechanism
- Two Metal, 3 Layer Capability
- Substrate Heater
- S&A 250B Network Analyzer
- Plasma Cleaning
- Light pole
- Computer
- Windows® based System Software
- Printer (optional)
FACILITY REQUIREMENTS
| Power: | 380V or 208V 3-PHASE, 7 KVA, 50/60 Hz |
| Inlet Pressures: Air: Nitrogen: |
90 – 100 PSIG 70 – 100 PSIG |
| Argon/Oxygen 80/20 (plasma cleaning): | 10 PSIG |
| Cryo Pump Water Cooling: | 0.50 GPM @ 60° – 80°F |
| Diffusion Pump Water Cooling: | 0.25 GPM @ 60° – 80°F |
| Dimensions: | W 53 x D 34 x H 67.5 Inches (excluding Cryo Compressor) |