Aluminium Nitride

Aluminium Nitride (AlN) is a material that displays relatively high thermal conductivity for an electrically insulating ceramic. For this reason it plays an important role in microelectronics applications, including heatsinks and substrates.

Aluminium Nitride also benefits from producing an oxidation layer on its surface at elevated temperatures which protects the material itself at higher temperatures. It is also resistant to attack from most molten salts including chlorides and cryolite.

Aluminium Nitride applications:

  • Heatsinks in electronic devices
  • Electronic substrates
  • Transistor bases
  • Semiconductor manufacturing

Property Value

Chemical Formula Al-N

Density 3.25 g/cm3
Hardness 1170 Knoop
Modulus of Elasticity 43 - 50 x 106 psi
Flexural Strength 43 - 62 kpsi
Compressive Strength 300 kpsi
Poisson's Ratio 0.22
Fracture Toughness 2.9 MPa m1/2

Dielectric Strength 431 V/mil
Dielectric Constant 8 - 9 (@ 1 MHz)
Volume Resistivity >1011 Ohm-cm

Coefficient of Thermal Expansion 4.6 - 5.7 x 10-6/°C
Thermal Conductivity 100 - 180 W/mK
Maximum Working Temperature 1200 °C