6300137-10  Main Screen Display  SYSTEM CONFIGURATION  FACILITY REQUIREMENTS  •  Computer  •  Direct Direct Drive Roughing Pump  •  Cryo or Diffusion Pump  •  Light pole  •  System Software  Showing each mask status and deposition target.  •  Automatic Mask Flipping Mechanism  •  Printer  (optional)  •  Substrate Heater  •  Plasma Cleaning (optional)  •  Two Metal, 3 Layer Capability  •  Power:  380V or 208V 3-PHASE, 7 KVA, 50/60 Hz  •  Inlet Pressures:  •  Air:  90 -; 100 PSIG  •  Nitrogen:  70 -; 100 PSIG  •  Argon (plasma cleaning)  10 - PSIG  •  Cryo Pump Water Cooling:  0.5 GPM @ 60°- 80° F  •  Diffusion Pump Water Cooling  0.25 GPM @ 60°-80°F  •  Dimensions  W 53 x D 34 x H 67.5 Inches (excluding-  Cryo Compressor)

 S&A          5600 BASE
PLATING SYSTEM  •  Fully automated, computer controlled
Base Plating System  •  Quartz monitor crystal rotates on the
same spherical radius as devices being
plated for accurate plating control  •  Each mask can be plated to a different
thickness in the same deposition cycle  •  Mechanical assemblies shielded from
plating material and easily removed for
cleaning  •  Two spring mounted filament sources  for extended filament life  Plating Uniformity:  2% of plateback typical *  SPECIFICATIONS  * Performance based on mask dimensions of not greater then 3 x 4.2  inches.  (Patent No. 6,090,444)  •  Low profile bell jar assembly for easy
operator access  •  Supports various mask systems  •  Substrate heater  •  RF plasma bombard option  •  Plating units, Å , Hz, F², Å  of Si 02  •  Fast pump down time for high system
throughput