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Standard Specifications |
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| Material | Czochralski grown sapphire (>=99.995% High Purity monocrystalline Al2O3). | |||
| Surface Orientation | C-Plane (0001) surface orientation, also called 0-degrees, off M (1-100) 0.2°, 0.3° . Other offcuts available. | |||
| Crystallinity | No visual evidence of slips, twins, lineage or fractures | |||
| Dimensions | Outer Diameter | 50.8mm ± 0.1mm / 76.2mm ± 0.25mm / 100.0mm ± 0.4mm |
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| Thickness | 500μm ± 10μm / 430μm ± 10μm / 330μm ± 15μm |
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| Surface Flatness | <25μm, depending on thickness |
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| Surface Bow | <25μm, depending on thickness |
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| Surface Taper | <25μm, depending on thickness |
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| Primary Flat Length | 16mm ± 1mm / 22mm ± 1mm / 32.5mm ± 1mm |
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| Primary Flat Location | Parallel to the A-axis <1 1 -2 0>, within 0.2 ° |
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| Edges | The edges of the substrates have a ground finish. | |||
| Edge Chips | Edge defects in general will not exceed those stated in SEMI M3-91. | |||
| Frontside Surface Finish | A smooth, polished surface finish suitable for epitaxy. No visible scratches, pits, dimples or contamination allowed. Ra typically < 0.20nm. | |||
| Backside Surface Finish | Depends on whether wafer is single side polished or double side polished. SSP: Fine ground, Ra typically 0.4 to 1.5μm. DSP: Polished. | |||
| Note | Other wafers orientations are available, including R-plane (1 -1 0 2), A-plane (1 1 -2 0) and M-plane (1 -1 0 0) . | |||
The data above is representative only, with a combination of data from our suppliers, and should not be considered absolute or warrantable. Specifications will be in given in our quotations and additional information is available on request. For a quotation please do not hesitate to contact us with your specific requirements.
© Roditi International 2008