5511B
5511B
5511B
5511B
 6300130-07  MEASUREMENTS  SYSTEM CONFIGURATION  SAUNDERS & ASSOCIATES, INC.    Power:  220 Volts @ 30 A or 380 Volts @ 20 A, 3-Phase    Inlet Pressures:  150 PSIG Maximum    Air:  90 PSIG    Nitrogen:  20 PSIG (Turbo), 70 PSIG (Cryo)    Cryo Water Cooling:  0.5 GPM @70 ° F, typical    Dimensions:  52.5 x 34.5 x 55 Inches (excluding light pole &  cryo   compressor) (133.4 x 87.6 x 139.7cm)
Cryo pump compressor 19.5 x 24 x 19 inches
(49.2 x 61 x 48.3 cm) Light pole 39.5 inches (100.3 cm)
 FACILITY REQUIREMENTS    Motional Capacitance    Motional Inductance    Trim Sensitivity    Quality Factor    Plateback    Series Resonant Frequency    Load Resonant Frequency    Resistance    Shunt Capacitance    Light Pole    System Software    Closed Loop Water Cooled  Filament    Bar Code Reader (Optional)    Printer (Optional)    Digital High Drive (Optional)    Vector Voltmeter    Dual Output Synthesizer    X-Y Table Assembly    Turbo or Cryo Pump    Direct Drive Roughing Pump    Computer
5511B
5511B
Precise Positioning
5511B Quartz Wafer Plating System
   Quartz wafer final adjust plating   
system for AT strip resonators
contained on a single quartz wafer
   Plates crystals on two wafers
simultaneously
   Typical component tray holds four  wafers    Measured parameters are checked
against easy to define Q.C. limits after
each crystal is plated
 S&A  5511B QUARTZ WAFER  PLATING SYSTEM  SPECIFICATIONS  Frequency Range:  3 MHz - 300 MHz  Plating Performance :  ± 2  ppm  typical final frequency    Precise X-Y table positioning    Supports any wafer size and resonator
array requirement
   Measurement data can be saved to
disk and/or printed
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