6300186-06  Main Screen Display  SYSTEM CONFIGURATION  FACILITY REQUIREMENTS  •  Computer  •  Direct Direct Drive Roughing Pump  •  Cryo or Diffusion Pump  •  Light pole  •  System Software  Showing each mask status and deposition target.  •  Automatic Mask Flipping Mechanism  •  Printer  (optional)  •  Substrate Heater  •  Plasma Cleaning (optional)  •  Two Metal, Multilayer Capability  •  Power:  380 or 208V 3-PHASE, 7 KVA,
50/60 Hz  •  Inlet Pressures:  •  Air:  90 -; 100 PSIG  •  Nitrogen:  70 -; 100 PSIG  •  Argon (plasma cleaning)  10 - PSIG  •  Cryo Pump Water Cooling:  0.5 GPM @ 60°-80° F  •  Diffusion Pump Water Cooling  0.25 GPM @ 60°-80° F  •  Dimensions  W 53 x D 34 x H 67.5 Inches (excluding-  Cryo Compressor)

 S&A         5600 THIN-FILM
DEPOSITION SYSTEM  •  Low cost, computer controlled
deposition system  •  Quartz crystal sensor and substrates
rotate on the same spherical radius for
accurate thickness deposition control  •  Pneumatic actuated source shutter for
precise deposition termination  •  Each substrate holder can be plated to a
different thickness in the same
deposition cycle  •  Mechanical assemblies shielded from  deposition material are easily removed
for cleaning  Thickness Uniformity:  2% of total deposition, typical  SPECIFICATIONS  •  Two spring mounted filament holders
for extended filament life  •  Low profile bell jar assembly for easy
operator access  •  Substrate heater  •  Surface preparation by RF plasma
bombardment to promote adhesion to
the substrate  •  Fast pump down time for high system
throughput  (Patent No. 6,090,444)